The packaging for Intel’s Core i9-13900K processor has leaked, and whereas the leaked picture reveals that it follows the identical theme as the present 12900K – together with that wafer – there are some slight however attention-grabbing modifications.
The Core i9-13900K field was posted on Twitter by well-known leaker HXL, who obtained it from a closed WeChat group, as VideoCardz (opens in new tab) factors out (and naturally, stay skeptical about whether or not or not that is actual, as at all times).
i9k（thirteenth） PackagingSource: WeChat pic.twitter.com/ffQIf2KSZ1September 23, 2022
As you possibly can see, there are some notable modifications right here, and though Intel has nonetheless put the processor in a flowery case with a silicon wafer, this time, as an alternative of gold, it’s coloured silver.
Moreover, the case itself is far slimmer than the one the current-gen Alder Lake flagship sports activities, although the design in any other case stays fairly related.
Evaluation: Raptor Lake leaks are actually selecting up pace
What’s most attention-grabbing right here, after all, is the truth that a fast take a look at the field of the flagship Raptor Lake means that maybe Intel’s next-gen chips aren’t too removed from being launched now. Particularly since we simply noticed the Core i9-13900K in leaked PassMark benchmarks, so the thrill round these thirteenth gen processors appears to be gathering tempo.
The Raptor Lake processors are rumored to be launched subsequent week, probably on September 27, however the silicon received’t go on sale till October. These leaks, that are beginning to seem increasingly now, are an encouraging indication that we might even see these processors earlier in October, moderately than later.
As for the packaging itself, the change from a gold plate to a silver one looks as if an odd selection for Intel, suggesting one thing of a downgrade, at the very least subconsciously. You find yourself getting a silver medal for second place and a gold medal for first place. It’s good to see a slimmer case, and by way of holding issues a bit of extra environmentally pleasant; nonetheless, the additional packaging of wafers is moderately pointless and never so environmentally pleasant on this regard.
We have now a sense that the wafer trick is getting its final efficiency right here, and it might make sense for Intel to do a whole redesign of the case for the following era of processors in 2023, which will probably be Meteor Lake (since that will probably be a giant change with the drop to 7nm, lastly).